XIII SBMicro

• Subject: XIII SBMicro
• From: Ivan Jorge Chueiri <chueiri@lac.copel.br>
• Date: Wed, 11 Mar 1998 15:59:28 -0300
• CC: comp-net@listas.ansp.br, sbis-l@vortex.ufrgs.br, sbeb@deb.fee.unicamp.br, cnpq-l@listas.ansp.br, capes-l@listas.ansp.br, cleiadm@ing.puc.cl, sbc-graf@cos.ufrj.br, lprolog@cis.upenn.edu, amast@cs.utwente.nl, kbcsl@uni-paderborn.de, PetriNets@daimi.aau.dk, compunode@compulog.org, rewriting-list@lorraine.loria.fr, acclaim@sics.se, alp-list@intellektik.informatik.th-darmstadt.de, aal@anu.edu.au, deduktion@intellektik.informatik.th-darmstadt.de, fg121@bach.informatik.uni-ulm.de, logic@cs.stanford.edu, qed@mcs.anl.gov, linguist@tamvm1.tamu.edu, linguist@listserv.linguistlist.org, philos-l@liverpool.ac.uk, theorem-provers@ai.mit.edu, announce@sigart.acm.org, colibri@let.ruu.nl, kgs@dbai.tuwien.ac.at, linear@cs.stanford.edu, aisb@cogs.sussex.ac.uk, aphil-l@coombs.anu.edu.au
• Organization: LAC - UFPR/COPEL
• References: <Pine.GSO.3.95.980311100230.12657A-100000@caruaru>

XIII SBMicro - INTERNATIONAL CONFERENCE ON MICROELECTRONICS AND
PACKAGING

                            AUGUST 12 TO 14, 1998 - CURITIBA, PR -
BRAZIL

                                      FIRST CALL FOR PAPERS

                                           The Conference

The Brazilian Microelectronics Society (SBMicro) and the International
Microelectronics and Packaging Society (IMAPS) will sponsor the XIII
SBMicro -  International Conference on Microelectronics and Packaging
technologies. The XIII ICMP is organized by LAC, the Central Research
and Development Laboratory of the Federal University of Paraná State,
UFPR, and the Power Utility Company of Paraná, COPEL. This special
edition of the SBMicro conference reflects the progressive integration
of microelectronics design and CAD with packaging and manufacturing
technologies, and features strong participation of industry and
academia. Two-day advanced tutorial courses and a Microelectronics
School*, will be taught by prominent national and international
scientists on August 10, 11. Topics include but are not limited to: 

- Analog and Digital VLSI circuits, systems and applications;
- Area-array I/O & interconnect, chip place & route, BGA , CSP
- Automotive and power electronics, materials and devices;
- Design automation, synthesis, verification, physical design;
- Design for testability;
- DfT, test synthesis, BIST, system-on-silicon test, design reuse;
- Fault tolerant architectures;
- Embedded systems, core-based IC design, reconfigurability;
- Hardware/software and chip/package co-design and modelling;
- Implementation techniques, analog and digital gate arrays;
- Low-power RF IC design/packaging, RFID, wireless telecoms;
- Low-voltage signal processing, companding, A/Ds, D/As;
- Package and technology roadmaps, engineering education;
- Process design/characterisation, modelling, reliability;
- Sensors and actuators, microsystems and CAD display;
- Wirebonding, thermal effects and models, material R&D.

                                  Instructions for Preparation of Papers

Prospective authors are invited to submit original manuscripts, which
should clearly state the purpose of the work, the major contributions to
the state-of-art, specific experimental results and their significance,
in either of two formats: 
Regular Papers: up to 8 pages for oral presentation.
Extended abstracts: up to 3 pages, for presentation in Poster Sessions.

All accepted manuscripts (in English) will be published in the
conference proceedings. One camera-ready original and 3 copies should be
prepared in single spaced, A4 paper (297 x 210mm), with 25mm margins on
each side, "Times New Roman" font, 10 point minimum font size. The first
page must include title, author(s) name(s) e-mail(s) and abstract (100 -
150 words), followed immediately by the body of the paper. Pages must
not be numbered.

                                       Submission of Manuscripts
Deadline

                                                             April 4,
1998

                              Journal of Solid-State Devices and
Circuits

All authors of papers presented at the conference are encouraged to
submit improved versions for publication in the SBMicro-sponsored
Journal of Solid-State Devices and Circuits. Information for submission
for journal publication is available from the editor at the SBMicro
office: Av. Prof. Luciano Gualberto, 158 - Trav. 3, CEP 05508-900, São
Paulo, SP - Brazil, or from http://www.dsif.fee.unicamp.br/sbmicro

Organizing Committee

General Chair:                 Ivan Jorge Chueiri
                                        chueiri@lac.copel.br

Program Chair:               Carlos Alberto dos Reis Filho
                                       carlos_reis@lpm2.fee.unicamp.br

Tutorials Chair:             Gerson Machado
                                       gerson@ifi.uio.no

Local Arrangements      Odila Kirchner
                                       odila@lac.copel.br

PHONE: +55 41 331 4391
FAX:       +55 41 266 3582

Further Information

icmp98@lac.copel.br
http://www.lac.copel.br

PAPER SUBMISSION INFORMATION
Roberto A. Hexsel
UFPR - Depto de Informatica
Caixa Postal 19081
81531-990 - CURITIBA, PR - BRASIL
Phone: +55(41)267-5244 - FAX +55(41)267-6874
e-mail: roberto@inf.ufpr.br


* for undergraduate and technical secondary school (in Portuguese).

• 5th WoLLIC'98 - 3rd Call
• From: Ruy de Queiroz <ruy@di.ufpe.br>

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